INSULATION PRINTER (SIDE TYPE)

[Overview]

It is a facility of feeding the Carrier Plate (Thereinafter referred to as CP)
where chips are stacked up in a way of Magazine and discharging it
after printing and drying.

[Major Composition]

- Screen Printing(Air Pressure)
- Align Vision
- Inspection Vision

INSULATION PRINTER (PI TYPE)

[Overview]

It is a facility of feeding PI substrates in various sizes
in a way of Magazine and discharging them after printing and drying.

[Major Composition]

- Screen Printing(Air Pressure)
- Align Vision
- Inspection Vision

HIGH-SPEED INSPECTOR

[Overview]

It is a facility of feeding a tray where chips are stacked up and
piling up good chips on a tray and separating bad chips onto another tray
after measuring two chips at a time.

[Major Composition]

- Motorize Pick-up
- Align Vision
- Inspection Vision

CHIP RESISTOR PRINTER

[Overview]

It is a facility of feeding various ceramic substrates of
the chip resistance process in a way of Magazine and
discharging them after high-speed printing and drying.

[Major Composition]

- Screen Printing(Motorize)
- Align Vision
- Inspection Vision

CHIP DIPPING MACHINE

[Overview]

It is a facility of feeding the Carrier Plate (thereinafter referred to as CP)
where chips are piled up into a dryer after performing the dipping work
through each section with the dipping head unit.

[Major Composition]

- Motorize Dipping
- Align Vision
- Inspection Vision

JET PRINTER

[Overview]

It is a jet-typed printer to improve the level difference of the complete bar
and performs application of electrodes after checking alignment.

[Major Composition]

- Nozzle Jet Printing
- Align Vision